Luna Labs - Developmental Technologies

LUNA Electrically Conductive Structural Adhesives

Luna’s XPN1 and XPC1 adhesives combine the strength of an aerospace structural adhesive with the conductivity and shielding of an electrical adhesive.  Luna XPN1 is a nickel-filled system and Luna XPC1 is an all carbon variant for nickel intolerant applications.  Both adhesives can be used in bonding applications that require excellent structural strength combined with ESD protection, EMI shielding, and possibly lightning strike protection.  The adhesives are suitable for use with numerous substrates including bare and treated aluminum alloys, titanium alloys, and carbon composites.  The products demonstrate comparable lap shear strength to aerospace structural epoxies, exhibit very low bond resistance, and are suitable for both spatula and syringe application, and some filling/potting applications.  For more information please contact us at